COMPAS-w is an application of our COMPAS process to optics in wafer format. Wafers offer the possibility to handle large numbers of small optical elements much more easily than with single elements. Wafers can contain from tens to thousands of lenses which can be handled, coated, aligned and bonded all at once. The individual lenses are only singularized at the end of the process. COMPAS-w molds are made using our DPI technology, COMPAS stands for Compression Molded Polymer Aspheres, for more information on these processes, have a look at our Technology page.

COMPAS-w combines the best of the COMPAS process with a highly productive way of making optics: wafers. This isothermal polymer molding process allows to replicate intricate details with a high accuracy, that can never be achieved using conventional injection-compression molding. This makes it possible to include mechanical, centration and other functions next to the optical surfaces.

Process Isothermal closed-cavity precision pressing
Wafer size, number of lenses/elements Max 200 mm diameter, up to one thousand lenses or up to 50 MLAs
Designs Double-sided spherical, highly aspherical, freeform, Fresnel, diffractive, MLA, mechanical I/F and centration
Thickness tmax > 5 mm, tmin < 0.2 mm, tmax/tmin > 10
Form accuracy PV 100 nm (using compensation)
Surface finish Typically 2 nm Ra
Centration upper to lower surfaces Up to 1-2 µm
Internal corner radius < 5 µm
Materials Thermo-formable polymers: PC, PMMA, TOPAS, ZEONEX, OKP4, etc

Possible applications are numerous and cover a wide range of industries. We have already successfully applied this technology to:

  • Lenses for medical imaging devices
  • Lenses for augmented reality and virtual reality
  • Lenses for mobile imaging
  • etc.